: Fixes bugs, improves power management, or enhances wear-leveling algorithms without requiring a physical hardware replacement.
| Parameter | Specification | | :--- | :--- | | | 32 GB (Raw) / ~29.1 GiB user-addressable | | Interface | e-MMC (Embedded Multi-Media Card) v5.1 compliant Backward compatible with v5.0, v4.5 | | Bus Mode | HS400 (High Speed 400 MHz DDR) 8-bit and 4-bit bus widths supported | | Sequential Read (Max) | Up to 310 MB/s | | Sequential Write (Max) | Up to 150 MB/s | | Random Read (4KB) | Up to 15,000 IOPS | | Random Write (4KB) | Up to 4,000 IOPS | | Operating Voltage | VCC (NAND): 2.7V – 3.6V VCCQ (Controller I/O): 1.7V – 1.95V or 2.7V – 3.6V | | Temperature Range | Commercial: 0°C to +70°C Industrial (BXXX variant): -40°C to +85°C | | Endurance | 3,000 – 5,000 program/erase cycles (depending on firmware) | | Package | VFBGA – 153 balls, 0.5mm pitch Dimensions: 11.5mm x 13.0mm x 1.0mm (typical) | | Power Consumption | Active Read: 150 mW (typ) Active Write: 200 mW (typ) Sleep mode: < 5 mW |
Read disturb becomes critical after 100K read cycles on a block without intervening refresh.
The "32G" signifies a 32GB storage capacity , providing ample space for operating systems and user data in mid-range or budget-tier hardware.
It looks like you've provided a specific product code: KMGD6000BM-BXXX 32G FFU . This seems to refer to a memory module, specifically a type of RAM (Random Access Memory) designed for use in computers or other compatible devices. Let's break down the components of this code to create informative content:
When designing with this device, expect to allocate:
The specific feature set (32GB capacity, FFU support, industrial temperature option) makes the KMGD6000BM-BXXX ideal for several demanding sectors: